Additive Web-Circuit Technology TM

Replaces Jumper Wire Engineering Changes!

Solid Copper process for RoHS and non-RoHS compliant PCBs.

Capabilities: solid copper added traces and trace cuts on bare PCB, new SMT pads for automated assembly

• Low and consistent trace height for assembly ease
• Assembly matched selective soldering of terminations (lead or no-lead).
• Solid copper for the best electrical performance.
• Low Thermal Exposure to PCB for all surface finishes.
• Final mask coating for protection and visual appeal

The Additive Process

Test and Verification

Reliability

Process Flow and Design

RFQ.doc

Application Photos

Circuits Assembly July 2008